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Polyimide Material
Chemical structure and properties
The molecular structure of PI centers around an imide ring, formed through the condensation polymerization reaction of dianhydrides (such as pyromellitic dianhydride) and diamines (such as diaminodiphenyl ether). Its characteristics include:
1. High temperature resistance: The long-term operating temperature can reach up to 300℃, and some models can withstand temperatures above 400℃.
2. Mechanical properties: The tensile strength is up to 190 MPa (such as PAI type), and the mechanical properties are superior to aramid fibers.
3. Chemical stability: Resistant to corrosion and radiation, with low dielectric loss, suitable for extreme environments.
Classification and application fields
PI can be classified into the following types based on their morphology and applications:
1. Thin film (such as "gold thin film"): used in flexible circuit boards, lithium battery separators, and spacecraft thermal insulation layers, featuring ultra-thin (micron-level) thickness and high thermal dimensional stability.
2. Engineering plastics: including polyetherimide (PEI) and polyamide-imide (PAI), used for precision components such as bearings, gears, and medical devices.
3. Fiber and foam: High-temperature resistant fibers are used for protective clothing, while foam materials are used for thermal insulation and noise reduction in ships.
Core Advantages
• Versatility: The only polymer that excels in multiple fields such as electronics, aviation, and energy.
• Synthesis flexibility: Customizable properties (such as soluble PI or photosensitive PI) can be achieved by adjusting monomers.